Devices and methods related to stacked duplexers
US9660609B2 · kind B2 · utility
28Cited by
1References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 7, 2016 |
| Grant date | May 23, 2017 |
| Priority date | — |
| Expiry date | Jul 7, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04B1/16
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Devices and method related to stacked duplexers. In some embodiments, an assembly may include a first wafer-level packaging (WLP) device having a radio-frequency (RF) shield. The assembly may also include a second WLP device having an RF shield, the second WLP device positioned over the first WLP device such that the RF shield of the second WLP device is electrically connected to the RF shield of the first WLP device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.