Printed wiring board
US9661762B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 5, 2014 |
| Grant date | May 23, 2017 |
| Priority date | — |
| Expiry date | Nov 5, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4602
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed wiring board includes a core substrate including a resin insulating layer and multiple conductor layers, a first wiring structure formed on a first surface of the core substrate and including a conductor layer and a resin insulating layer, and a second wiring structure formed on a second surface of the core substrate and including a conductor layer and a resin insulating layer. The core substrate is interposed between the first wiring structure and the second wiring structure such that the resin insulating layers and conductor layers in the core substrate, first wiring structure and second wiring structure are alternately laminated, the resin insulating layer in the first wiring structure has a vol % of resin which is larger than a vol % of resin in the resin insulating layer in the second wiring structure such that a difference in the vol % of resin in the first and second wiring structures is in the range of from 0.5% to 5.0%.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.