Photosensitive thermoplastic resin composition and molded product using same
US9663631B2 · kind B2 · utility
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10Claims
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Key dates
| Filing date | May 9, 2013 |
| Grant date | May 30, 2017 |
| Priority date | — |
| Expiry date | May 9, 2033 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2333/12
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A photosensitive thermoplastic resin composition that can be melt-molded to provide a molded product and can be crosslinked by irradiation of the molded product with light, and a molded product made of the same. The photosensitive thermoplastic resin composition contains a thermoplastic polymer and a photocrosslinking agent compatible with the thermoplastic polymer. The composition is melt-moldable, and a melt-molded product of the composition is crosslinkable by irradiation of light. The composition is melt-molded into a given shape to provide a molded product, and the molded product is photocrosslinked by irradiation of light.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.