Polyamide moulding composition and use thereof
US9663655B2 · kind B2 · utility
18Cited by
3References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 8, 2015 |
| Grant date | May 30, 2017 |
| Priority date | — |
| Expiry date | Apr 8, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2205/03
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The invention relates to a polyamide molding composition which comprises an amorphous polyamide, a partially crystalline, aliphatic polyamide and also glass fibers for reinforcement. Furthermore, the polyamide molding composition according to the invention comprises a polyamide made of a cycloaliphatic diamine and a dimerized fatty acid. The polyamide molding compositions according to the invention are used in the production of electrical or electronic components, housings or housing components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.