Circuit board configurations facilitating operation of heat sensitive sensor components
US9664569B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 15, 2015 |
| Grant date | May 30, 2017 |
| Priority date | — |
| Expiry date | May 15, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A multilayered circuit board having a metal-free region vertically extending through at least a portion of a conductive layer, which lies generally parallel to a horizontal plane, vertically spaced from an outer surface. Heat-emitting and heat-sensitive components are mounted on the outer surface. The heat-emitting component is vertically and laterally spaced from the metal-free region, whereas the heat-sensitive component is vertically spaced and laterally aligned within the metal-free region such that the metal-free region is a thermal barrier that shields heat-sensitive component from radial heat flowing from the heat-emitting component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.