Power semiconductor module
US9666395B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 16, 2014 |
| Grant date | May 30, 2017 |
| Priority date | — |
| Expiry date | May 16, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldEngines, pumps, turbines
- WIPO sectorMechanical engineering
Abstract
Provided is a power semiconductor module wherein stress generated at a soldering section of a relay terminal is relaxed. A power semiconductor module (1) is provided with a substrate (2), relay terminals (9, 10), external connecting terminals (13, 14) and a relay terminal holding member (6). The relay terminals (9, 10) are connected to the substrate (2) with a solder (4) therebetween. The external connecting terminals (13, 14) are bonded to the relay terminals (9, 10), respectively. The non-conductive relay terminal holding member (6) holds end portions of the relay terminals (9, 10) said end portions being on the side bonded to the solder (4).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.