Multilayer wiring board with metal foil wiring layer, wire wiring layer, and interlayer conduction hole
US9668345B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 27, 2013 |
| Grant date | May 30, 2017 |
| Priority date | — |
| Expiry date | May 26, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1572
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multilayer wiring board includes a first metal foil wiring layer that has at least two or more layers of metal foil wiring lines and is arranged on a mounting surface side for mounting a surface mount type component, a wire wiring layer that is arranged on an opposite side of the mounting surface, and in which an insulation coating wire is wired, and a first interlayer conduction hole that has a conduction part which electrically connects the metal foil wiring line positioned on a surface of the first metal foil wiring layer to at least one of the metal foil wiring line in an inner layer of the first metal foil wiring layer and the insulation coating wire of the wire wiring layer. A hole diameter of the first interlayer conduction hole varies in a board thickness direction of the multilayer wiring board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.