Method of embedding a pre-assembled unit including a device into a flexible printed circuit and corresponding assembly
US9668352B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Mar 15, 2013 |
| Grant date | May 30, 2017 |
| Priority date | — |
| Expiry date | Sep 17, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49146
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A flexible printed circuit assembly, having a first flexible printed circuit having a first conductive layer and a device that is connected the first conductive layer; and a second flexible printed circuit having a second conductive layer, an insulating center layer, and a third conductive layer, the insulating center layer arranged in-between the second and the third conductive layers, the second conductive layer and the insulating center layer being removed to form an opening to expose an upper surface of the third conductive layer, wherein the first flexible printed circuit is arranged such that the device is accommodated inside the opening, a lower surface of the device being in thermal connection with the third conductive layer, and the first conductive layer is arranged to be in electrical connection with the second conductive layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.