Conformable thermal bridge
US9668380B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 29, 2015 |
| Grant date | May 30, 2017 |
| Priority date | — |
| Expiry date | Sep 29, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/066
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A thermal bridge includes a frame and an array of multiple plates. The frame defines a bridge opening, and the array of plates is held in the bridge opening. The plates are stacked side-by-side along a stack axis. The array extends between a top end defined by top edges of the plates and a bottom end defined by bottom edges of the plates. Each plate is independently vertically compressible between the respective top and bottom edges of the plate relative to other plates in the array. The top end of the array is configured to engage and conform to a contour of a first external surface. The bottom end of the array is configured to engage and conform to a contour of a second external surface. The plates are thermally conductive to transfer heat between the first and second external surfaces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.