Patent · US Active

Adhesive compositions and use thereof

US9670390B2 · kind B2 · utility

1Cited by
5References
23Claims
0Family size

Assignee

Inventor

Key dates

Filing dateJan 25, 2013
Grant dateJun 6, 2017
Priority date
Expiry dateJul 31, 2033

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB32B2264/04
  • WIPO fieldBasic materials chemistry
  • WIPO sectorChemistry

Abstract

The present invention relates to new formulations for adhesive compositions and also to adhesive compositions particularly for a hybrid adhesive comprising at least one mixture of an amino resin and at least one polyether, and the combination of this mixture with isocyanate, and also to the use of polyethers in adhesives based on amino resins. These adhesive compositions are especially suitable for use as adhesives for woodbase materials, more particularly OSB boards, fiberboards, or chipboards. In a further aspect the present invention relates to processes for producing such woodbase materials from lignocellulosic products of comminution, more particularly to processes for producing OSB boards, wood fiberboards, or chipboards, where the lignocellulosic products of comminution are contacted with the adhesive composition of the invention and subsequently the woodbase materials are obtained by pressing with heat treatment. Lastly, the present invention is directed to woodbase materials obtainable accordingly.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.