Stable thermal radical curable silicone adhesive compositions
US9670392B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 10, 2014 |
| Grant date | Jun 6, 2017 |
| Priority date | — |
| Expiry date | Jul 6, 2034 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K2003/2265
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A stable thermal radical curable silicone composition is provided that comprises (I) a clustered functional polyorganopolysiloxane having one or more radical curable groups selected from an acrylate group and a methacrylate group; (II) a reactive resin and polymer; (III) a radical initiator; (IV) a moisture cure initiator; and (V) a crosslinker. The reactive resin and polymer includes (a) an organopolysiloxane polymer and (b) an alkoxy-functional organopolysiloxane resin. The alkoxy-functional organopolysiloxane resin comprises the reaction product of a reaction of (i) an alkenyl-functional siloxane resin, (ii) an alkoxysilane-functional organosiloxane, and (iii) an endcapper in the presence of (iv) hydrosilylation catalyst. The stable thermal radical curable silicone composition can be utilized for electronics applications.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.