Manifolding arrangement for a modular heat-exchange apparatus
US9670911B2 · kind B2 · utility
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83References
15Claims
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Key dates
| Filing date | Feb 22, 2011 |
| Grant date | Jun 6, 2017 |
| Priority date | — |
| Expiry date | Jan 25, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/30
- WIPO fieldEngines, pumps, turbines
- WIPO sectorMechanical engineering
Abstract
A heat-exchanger module that conveys a fluid through one or more heat exchangers with little or no pressure drop is presented. The heat-exchanger module comprises a first manifold that smoothly channels the fluid from a fluid source to each of the heat exchangers. The heat-exchanger module further comprises a second manifold that smoothly channels the fluid from the heat exchangers to a fluid sink. The manifolds are dimensioned and arranged to mitigate development of pressure drops in the fluid flow.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.