Component with deformable pads
US9670953B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 18, 2013 |
| Grant date | Jun 6, 2017 |
| Priority date | — |
| Expiry date | Dec 12, 2033 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF16C2226/60
- WIPO fieldMechanical elements
- WIPO sectorMechanical engineering
Abstract
A component (10) is adapted for contact with a mating component (50) during attachment of the components to one another to form a related assembly in which a deformable pad (26) or pads improve stress distribution. The component includes a body having an interface surface in which the body is adapted to be contacted with the mating component at the interface surface of the body. One or more deformable pads are formed in the interface surface. Each deformable pad has a top surface that is offset outwardly from the interface surface relative to the body and a groove surrounding the deformable pad that is offset inwardly from the interface surface relative to the body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.