Integrated chip package with optical interface
US9671572B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 22, 2014 |
| Grant date | Jun 6, 2017 |
| Priority date | — |
| Expiry date | Sep 22, 2034 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4269
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A chip package includes an integrated circuit and an optical integrated circuit (such as a hybrid integrated circuit) with an optical source and/or an optical receiver. The integrated circuit and the optical integrated circuit may be proximate to each other on opposite sides of an interposer in the chip package. Moreover, the integrated circuit may include a driver circuit of electrical signals for the optical source and/or a receiver circuit of electrical signals from the optical receiver. Furthermore, the optical integrated circuit may be positioned in a hole or an etch pit in a substrate, and an alignment feature may mechanically couple the substrate to an optical-fiber assembly, so that the optical-fiber assembly is positioned relative to the interposer and the optical integrated circuit. In particular, the optical-fiber assembly may partially overlap the interposer, so that optical signals are provided and/or received from the optical integrated circuit through the interposer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.