Low-current fuse stamping method
US9673012B2 · kind B2 · utility
0Cited by
7References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 16, 2013 |
| Grant date | Jun 6, 2017 |
| Priority date | — |
| Expiry date | Sep 9, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49107
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A convenient, cost-effective method for manufacturing low-current fuse elements. The method may include the steps of stamping a substrate out of a sheet of material and stamping at least one hole in the substrate. The method may further include the steps of bonding a layer of fuse material to a surface of the substrate with a portion of the fuse material covering the hole, stamping a fuse element out of the portion of fuse material covering the hole, and separating an individual fuse from the fuse material and the substrate. A low-current fuse can thereby be obtained using an easily performed stamping process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.