Semiconductor device
US9673142B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 12, 2016 |
| Grant date | Jun 6, 2017 |
| Priority date | — |
| Expiry date | Jul 12, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/00014
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device with enhanced reliability. The semiconductor device has a wiring substrate which includes a first terminal electrically connected with a power supply potential supply section of a semiconductor chip, a first wiring coupling the power supply potential supply section with the first terminal, a second terminal electrically connected with a reference potential supply section of the semiconductor chip, and a second wiring coupling the reference potential supply section with the second terminal. The first terminal and second terminal are arranged closer to the periphery of the wiring substrate than the semiconductor chip. The second wiring is extended along the first wiring.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.