Semiconductor package and system with an isolation structure to reduce electromagnetic coupling
US9673164B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 25, 2014 |
| Grant date | Jun 6, 2017 |
| Priority date | — |
| Expiry date | Apr 25, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A system and method for packaging a semiconductor device that includes a structure to reduce electromagnetic coupling is presented. The semiconductor device has a substrate on which a first circuit and a second circuit with inputs and outputs are formed proximate to each other. An isolation structure of electrically conductive material is located between components of the first and second circuits, the isolation structure being configured to reduce inductive coupling between those components during an operation of the semiconductor device. The isolation structure may be positioned on or over exterior surfaces of the semiconductor device housing or inside the housing. In one embodiment, the isolation structure includes a first leg extending transverse to the surface of the substrate and a first cross member connected to and projecting from the first leg over the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.