Three-dimensional mounting method and three-dimensional mounting device
US9673166B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 19, 2014 |
| Grant date | Jun 6, 2017 |
| Priority date | — |
| Expiry date | Nov 19, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1434
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A three-dimensional mounting method for successively laminating N number of upper-layer joining materials includes positioning a first upper-layer joining material relative to a lowermost-layer joining material by recognizing an alignment position of the lowermost-layer joining material and a lower face alignment position of the first upper-layer joining material by a two-field image recognition unit, storing positional coordinates of the alignment position of the lowermost-layer joining material, positioning an (n+1)-th upper-layer joining material relative to an n-th upper-layer joining material by recognizing an upper face alignment position of the n-th upper-layer joining material and a lower face alignment position of the (n+1)-th upper-layer joining material, storing positional coordinates of the upper face alignment position of the n-th upper-layer joining material, recognizing an upper face alignment position of the N-th uppermost-layer joining material, and storing positional coordinates of the upper face alignment position of the N-th uppermost-layer joining material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.