Patent · US Active

Integrated inductor for integrated circuit devices

US9673268B2 · kind B2 · utility

0Cited by

5References

11Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Andreas Duevel · Bad Salzdetfurth, DE
Telesphor Kamgaing · Chandler, US
Valluri Rao · Saratoga, US
Uwe Zillmann · Braunschweig, DE

Key dates

Filing date	Dec 29, 2011
Grant date	Jun 6, 2017
Priority date	—
Expiry date	Dec 29, 2031

Classification

Technology area (CPC H)Electricity
CPC primaryH10D84/00
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A three-dimensional inductor is formed in an integrated circuit die using conductive through-body-vias which pass through the body of the die and contact one or more metal interconnect layers on the front side of the die and terminate on the back side of the die. In another embodiment, the through-body-vias may pass through a dielectric material disposed in a plug in the body of the die. In yet another aspect, a transformer may be formed by coupling multiple inductors formed using through-body-vias. In still another aspect, a three-dimensional inductor may include conductors formed of stacks of on chip metallization layers and conductive through-layer-vias disposed in insulation layers between metallization layers. Other embodiments are described.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.