Semiconductor component and process for fabricating a semiconductor component
US9673350B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 12, 2013 |
| Grant date | Jun 6, 2017 |
| Priority date | — |
| Expiry date | Aug 12, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/809
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semi-conducting component including a semi-conducting layer of a first conductivity type including a plurality of semi-conducting zones of a second conductivity type opposite that of the semi-conducting layer, and an insulating layer. The component further includes a first bias mechanism configured to bias the semi-conducting layer and a second bias mechanism configured to bias a semi-conducting zone. The first bias mechanism includes a conducting layer in contact with the insulating layer and which includes passageways for each second bias mechanism with the spacing between the conducting layer and the second bias mechanism which is located facing the corresponding semi-conducting zone.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.