Electronic device and semiconductor package with thermally conductive via
US9674940B2 · kind B2 · utility
3Cited by
20References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 14, 2015 |
| Grant date | Jun 6, 2017 |
| Priority date | — |
| Expiry date | Aug 14, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10969
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic device and semiconductor package include a printed circuit board and a semiconductor device mounted thereon. The printed circuit board includes one or more thermally conductive vias for dissipating heat.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.