Method of making copper pillar with solder cap
US9674952B1 · kind B1 · utility
6Cited by
3References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 10, 2014 |
| Grant date | Jun 6, 2017 |
| Priority date | — |
| Expiry date | Mar 10, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/247
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electrical interconnect includes a copper pillar and solder cap. The copper pillar and solder cap are formed onto a contact pad or an under bump metallurgy (UBM). In some applications, the contact pad or UBM is part of an electronic component, such as a semiconductor chip. In other cases, the contact pad is part of laminated substrate, such as a printed circuit board (PCB), or a ceramic substrate. The copper pillar and the solder cap are printed using an ink printer, such as an aerosol ink jet printer. A post heat treatment solidifies the interconnection between the contact pad or UBM, the copper pillar and the solder cap.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.