Double-layer injection molding casing and method for manufacturing the same, electronic apparatus
US9676129B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 23, 2011 |
| Grant date | Jun 13, 2017 |
| Priority date | — |
| Expiry date | Aug 16, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/445
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A double-layer injection molding casing and a method for manufacturing the same, an electronic apparatus are provided by this invention, which adapts to an injection molding field and can solve the problems of a conventional double-layer injection molding casing such as complicated manufacturing process and low production efficiency. The double-layer injection molding casing of this invention includes an outer layer and an inner layer. A locating structure integrally formed with the inner layer is located at an inner surface of the inner layer. The method for manufacturing the double-layer injection molding casing includes: applying a multiple injection molding process, wherein the locating structure of the double-layer injection molding casing is integrally formed with the inner layer in the same injection molding step. The electronic apparatus of this invention includes the double-layer injection molding casing. The double-layer injection molding casing can be used as a casing of the electronic apparatus.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.