Patent · US Active

UV-curing hot melt adhesive containing low content of oligomers

US9676977B2 · kind B2 · utility

1Cited by

1References

16Claims

0Family size

Assignee

Henkel AG & Co. KGaA · DE

Inventors

Hans-Georg Kinzelmann · Pulheim, DE
Yang Cao · Niskayuna, US
Uwe Franken · Dormagen, DE
Hongxia Zhao · Mölndal, SE

Key dates

Filing date	Jan 26, 2015
Grant date	Jun 13, 2017
Priority date	—
Expiry date	Jan 2, 2036

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC08G2270/00
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

A reactive hot melt adhesive comprising a blend of a (meth)acrylate polymer, a polyurethane polymer containing (meth)acrylate groups and a polyurethane prepolymer containing NCO-groups wherein the content of low molecular weight (meth)acrylate urethanes is less than 1 wt % of the adhesive. The adhesive provides a fast and improved green strength during application.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.