Film formation apparatus and film formation method for forming metal film
US9677185B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 4, 2014 |
| Grant date | Jun 13, 2017 |
| Priority date | — |
| Expiry date | Jun 3, 2034 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D3/38
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A film formation system for continuously forming metal films with desired thickness on the surfaces of substrates, and increase the film forming speed while suppressing abnormality of the metal films. A film formation system includes an anode; a solid electrolyte membrane between the anode and a substrate serving as a cathode such that a metal ion solution is disposed on the anode side thereof; and a power supply portion for applying a voltage across the anode and the substrate. A voltage is applied across the anode and the substrate o deposit metal out of the metal ions contained in the solid electrolyte membrane onto the substrate surface, thereby forming a metal film made of the metal ions. The anode has a base material, which is insoluble in the metal ion solution, and a metal plating film made of the same metal as the metal film, formed over the base material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.