Packaging module of power converting circuit and method for manufacturing the same
US9679786B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 24, 2016 |
| Grant date | Jun 13, 2017 |
| Priority date | — |
| Expiry date | Feb 24, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19043
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The disclosure discloses a packaging module of a power converting circuit and a method for manufacturing the same. The packaging module of the power converting circuit includes a substrate, a molding layer and a plurality of pins. A power device is assembled at the substrate, a plurality of pins electrically are coupled to the power device, the molding layer covers the surface of the substrate with the power device, and at least a contact surface of the pins configured to electrically connect an external circuit is exposed. The molding layer includes a main hat-body part and a hat-brim part, the main hat-body part and the hat-brim part form a hat-shaped molding layer, and the hat-brim part is used to increase a creepage distance between the contact surfaces of the pins located at the top of the molding layer and the bottom of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.