Temperature control system for electrostatic chucks and electrostatic chuck for same
US9679792B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 25, 2013 |
| Grant date | Jun 13, 2017 |
| Priority date | — |
| Expiry date | Aug 27, 2035 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF25B2321/023
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A temperature control system, a wafer chuck, a thermal module for use with the chuck, and an apparatus for use in semiconductor manufacture are disclosed herein. The temperature control system includes: a target having a temperature, a fluid circulation loop coupled to the target for controlling the temperature of the target, a heating heat exchanger coupled to the fluid circulation loop for selectively providing heat to the fluid circulation loop, a cooling heat exchanger coupled to the fluid circulation loop for selectively providing cooling to the fluid circulation loop and a plurality of thermal electric elements carried by the target for selectively providing heating or cooling to the target. The heating heat exchanger and cooling heat exchanger provide gross control of the temperature of the target, and the plurality of thermal electric elements provide fine control of the temperature of the target.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.