Array substrate and manufacturing method thereof, display device
US9679924B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Apr 14, 2016 |
| Grant date | Jun 13, 2017 |
| Priority date | — |
| Expiry date | Apr 14, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D86/451
Abstract
An array substrate and manufacturing method thereof, a display device are provided. The array substrate includes a display region and a non-display region; the non-display region includes a first laminated structure and a second laminated structure that are separately disposed on a base substrate, a gap between the first laminated structure and the second laminated structure constitutes a connecting hole; the first laminated structure includes a first via hole provided for exposing a first metal layer, the second laminated structure includes a second via hole provided for exposing a second metal layer, the first via hole and the second via hole are connected to a connecting hole via breaches on corresponding walls, and the first metal layer and the second metal are electrically connected with a conductive film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.