Plated electrical contacts for solar modules
US9680042B2 · kind B2 · utility
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1References
16Claims
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Key dates
| Filing date | Dec 16, 2013 |
| Grant date | Jun 13, 2017 |
| Priority date | — |
| Expiry date | May 17, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/50
Abstract
The present invention concerns a plating method for manufacturing of electrical contacts on a solar module wherein the wiring between silicon solar cells in a solar module is deposited by electroplating onto a conductive seed. The wiring between individual silicon solar cells comprises wiring reinforcement pillars which improve the reliability of said wiring.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.