Light-emitting device
US9680075B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 30, 2013 |
| Grant date | Jun 13, 2017 |
| Priority date | — |
| Expiry date | Aug 30, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/882
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A light-emitting device in accordance with the present invention includes a mounting substrate; an LED chip bonded to a surface of the mounting substrate with a bond; and an encapsulating portion covering the LED chip. The bond transmits light from the LED chip. The mounting substrate includes: a light-transmissive member having a planar size larger than that of the LED chip; and first and second penetrating wirings which penetrate the light-transmissive member in the thickness direction thereof and are electrically connected to first and second electrodes of the LED chip via first and second wires, respectively. The light-transmissive member includes at least two light-transmissive layers with different optical properties which are stacked in the thickness direction. A light-transmissive layer of the light-transmissive layers which is farther from the LED chip is higher in reflectance to the light.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.