Wiring substrate and light emitting device
US9680078B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 24, 2015 |
| Grant date | Jun 13, 2017 |
| Priority date | — |
| Expiry date | Nov 24, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10106
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A wiring substrate includes ceramic layers and a conductive member. The ceramic layers have an uppermost ceramic layer and a lowermost ceramic layer. The conductive member includes an upper conductive layer disposed on an upper surface of the uppermost ceramic layer, an internal conductive layer interposed between the ceramic layers, and a lower conductive layer disposed on a lower surface of the lowermost ceramic layer. The conductive member defines vias electrically connecting the upper conductive layer, the internal conductive layer, and the lower conductive layer. A total number of a first vias connected to the lower conductive layer is larger than a total number of a second vias connected to the upper conductive layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.