Graded-ground design in a millimeter-wave radio module
US9680232B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 23, 2014 |
| Grant date | Jun 13, 2017 |
| Priority date | — |
| Expiry date | Mar 18, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/16225
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A millimeter-wave radio frequency (RF) module is provided. The RF module includes a multilayer substrate having at least a front layer, a back layer, a plurality of middle layers, a first ground layer, and a second ground layer, wherein the first ground layer includes a graded-ground plane having a pair of non-overlapping ground lines connected at a single connection point through a graded connection, and wherein the second ground layer includes a double graded-ground plane having a pair of overlapping ground lines connected at a single connection point through a graded connection, wherein the first ground layer and the second ground layer provide a reference ground to a transmission line included in the multilayer substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.