Molded enclosures having a seamless appearance
US9680249B2 · kind B2 · utility
2Cited by
7References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2016 |
| Grant date | Jun 13, 2017 |
| Priority date | — |
| Expiry date | Sep 30, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R43/18
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An enclosure for an AC to DC adapter has a continuous and seamless exterior surface. The enclosure includes a housing and a front wall that are joined by a bonded interface. The front wall is formed from a metallic interface plate and an exterior layer of plastic that is formed over the metallic interface plate and bonded to the housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.