High density connector
US9680266B2 · kind B2 · utility
5Cited by
13References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 18, 2015 |
| Grant date | Jun 13, 2017 |
| Priority date | — |
| Expiry date | Aug 18, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04Q2201/802
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
In one embodiment, a method for increasing potential data capacity for a high-density transceiver connector includes: aligning at least two transceiver-switch copper contacts opposite at least one network switch copper contact associated with a network switch, aligning at least two transceiver-cable copper contacts opposite at least one cable copper contact, and connecting the at least two transceiver-switch copper contacts to the at least two transceiver-cable copper contacts, wherein the high-density transceiver connector shares a form factor with a low-density transceiver connector.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.