Method for manufacturing microphone chip
US9681244B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 19, 2016 |
| Grant date | Jun 13, 2017 |
| Priority date | — |
| Expiry date | Oct 19, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2207/021
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing a microphone chip, includes steps of: providing a first underlay, and depositing insulating oxide layers at both sides; depositing the component layers on the insulating oxide layers respectively; depositing the tetraethyl orthosilicate oxide layers on the component layers; etching the tetraethyl orthosilicate oxide layers; patterning various deposition layers in the first underlay; providing the second underlay; depositing the oxide layers on the substrate; etching and patterning oxide layer; releasing the back plate; combining the first underlay and the second underlay by welding the tetraethyl orthosilicate oxide layer on the first underlay and the oxide layer on the second underlay under ambient temperature; etching the second underlay to form the back cavity; etching the first underlay to release the diaphragm and obtaining the microphone chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.