Changing printing control parameters based on measured solder paste deposits in certain subareas of a printed circuit board
US9681553B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 12, 2014 |
| Grant date | Jun 13, 2017 |
| Priority date | — |
| Expiry date | Jun 12, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/163
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
It is described a method for changing parameters for controlling a transfer of solder paste onto a printed circuit board (150, 250). The described method comprises (a) identifying first subareas (256, 258) of the printed circuit board (150, 250), which exhibit a first repeatability with respect to the amount of solder paste being supposed to be transferred onto the printed circuit board (150, 250), (b) identifying second subareas (252, 254) of the printed circuit board (150, 250), which exhibit a second repeatability with respect to the amount of solder paste being supposed to be transferred onto the printed circuit board (150, 250), wherein the first repeatability is smaller than the second repeatability, (c) transferring solder paste onto the printed circuit board (150, 250) at least at the second subareas (252, 254) of the printed circuit board (150, 250), (d) measuring the amount of solder paste which has been transferred to the second subareas (252, 254), and (e) changing the parameters for controlling a transfer of solder paste onto the printed circuit board (150, 250) in response to the measured amount of solder paste which has been transferred to the second subareas (252, 2…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.