Part design geometry for stenciling epoxies through orifices in film adhesive
US9682589B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 19, 2015 |
| Grant date | Jun 20, 2017 |
| Priority date | — |
| Expiry date | Jan 19, 2035 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2002/14362
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
An apparatus has a first structure, an adhesive layer having a first height adhered to the first structure, the adhesive layer having an array of openings, the adhesive layer having a region adjacent each opening having a height less than a first height. A print head has a stack of plates forming a jet stack, the jet stack having a nozzle plate with an array of nozzles, an array of transducers in contact with the jet stack opposite the nozzle plate, an adhesive layer having a first height adhered to the array of transducers, the adhesive layer having openings adjacent the transducers and regions adjacent the openings having a height less than the first height, and a conductive material in the openings of the adhesive layer in contact with the transducers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.