Thick-film paste containing lead-tungsten-based oxide and its use in the manufacture of semiconductor devices
US9683112B2 · kind B2 · utility
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1References
6Claims
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Key dates
| Filing date | Oct 21, 2014 |
| Grant date | Jun 20, 2017 |
| Priority date | — |
| Expiry date | May 2, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/50
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
The present invention provides a thick-film paste for printing the front side of a solar cell device having one or more insulating layers and a method for doing so. The thick-film paste comprises a source of an electrically conductive metal and a lead-tungsten-based oxide dispersed in an organic medium. The invention also provides a semiconductor device comprising an electrode formed from the thick-film paste.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.