Optical sensor arrangement and method of producing an optical sensor arrangement

US9684074B2 · kind B2 · utility

Assignee

• AMS AG · AT

Inventors

• Franz Schrank · Graz, AT
• Eugene G. Dierschke · Dallas, US
• Martin Schrems · Langenbruck, DE

Key dates

• Filing date: Dec 3, 2014
• Grant date: Jun 20, 2017
• Expiry date: Dec 3, 2034

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/0002
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

An optical sensor arrangement, in particular an optical proximity sensor arrangement comprises a three-dimensional integrated circuit further comprising a first layer comprising a light-emitting device, a second layer comprising a light-detector and a driver circuit. The driver circuit is electrically connected to the light-emitting device and to the light-detector to control the operation of the light-emitting device and the light-detector. A mold layer comprising a first light-barrier between the light-emitting device and the light-detector configured to block light from being transmitted directly from the light-emitting device to the light-detector.