Patent · US Active

Molding system and method for operating the same

US9684295B2 · kind B2 · utility

7Cited by
4References
10Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJul 12, 2016
Grant dateJun 20, 2017
Priority date
Expiry dateJul 12, 2036

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY02P90/02
  • WIPO fieldControl
  • WIPO sectorInstruments

Abstract

A method for operating a molding machine includes specifying a simulating domain corresponding to a genuine domain in a mold disposed on the molding machine. The method proceeds to perform a virtual molding by using a setting packing pressure profile to generate a simulated state waveform, generating a designed state waveform including an isobaric phase and an isochoric phase while taking into consideration the simulated state waveform, and obtaining an updated packing pressure profile for applying a molding pressure to a portion of the genuine domain while taking into consideration a difference between the simulated state waveform and the designed state waveform. Subsequently, the method proceeds to set the molding machine while taking into consideration the updated packing pressure profile to perform an actual molding by applying an actual molding pressure to the at least a portion of the genuine domain to prepare the molding product.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.