Bonding tool and method for high accuracy chip-to-chip bonding
US9685187B1 · kind B1 · utility
1Cited by
122References
6Claims
0Family size
Assignee
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Key dates
| Filing date | Sep 26, 2014 |
| Grant date | Jun 20, 2017 |
| Priority date | — |
| Expiry date | Sep 26, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01322
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A chip-to-chip eutectic bonding system includes a stage with a top surface, a bottom surface, and a plurality of vacuum apertures extending therebetween and a carrier with a top surface, the top surface including one or more smooth surface portions and one or more rough surface portions, wherein at least one smooth carrier surface portion laterally aligns to at least one vacuum aperture, and at least one of the stage's rough surface portions frictionally couples to at least one of the carrier's rough surface portions when the carrier top surface couples to and opposes the stage bottom surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.