Aluminum electrode, method of forming an aluminum electrode and electronic device therewith
US9685252B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 29, 2014 |
| Grant date | Jun 20, 2017 |
| Priority date | — |
| Expiry date | Oct 29, 2034 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/18
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present disclosure relates to an aluminum electrode, a method of forming an aluminum electrode and an electronic device therewith. An aluminum electrode according to one aspect of the present disclosure comprises: a bottom layer consisting of molybdenum; a top layer consisting of molybdenum; and an aluminum layer located between the bottom layer and the top layer, wherein the bottom layer, the top layer and the aluminum layer are formed at a temperature below 120° C. An aluminum electrode according to one embodiment of the present disclosure eliminates the mouse bite phenomenon. An aluminum electrode according to another aspect of the present disclosure comprises: a bottom layer consisting of a metal or metal-alloy nitride; a top layer consisting of molybdenum; and an aluminum layer located between the bottom layer and the top layer, wherein the bottom layer, the top layer and the aluminum layer are formed at a temperature below 120° C. An aluminum electrode according to another embodiment of the present disclosure eliminates both of the mouse bite phenomenon and the undercut phenomenon, and can further arrive at a desired profile angle by controlling the content of nitrogen.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.