Phase-change chamber with patterned regions of high and low affinity to a phase-change medium for electronic device cooling
US9685393B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 6, 2014 |
| Grant date | Jun 20, 2017 |
| Priority date | — |
| Expiry date | Mar 29, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49764
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A phase-change chamber, a method for fabricating a phase-change chamber and a heat dissipation apparatus for electronic device cooling are disclosed. The phase-change chamber includes: a phase-change medium capable of transitioning between a plurality of phases; a first surface for transitioning a portion of the phase-change medium from a first phase into a second phase; a second surface for transitioning a portion of the phase-change medium from the second phase into the first phase; and at least one supporting member along the circumference of the first surface and the second surface for separating and enclosing the first surface and the second surface. The first surface is patterned on a first plate and includes regions of high and low affinity to the phase-change medium. The second surface is received on a second plate and comprises low affinity to the phase-change medium.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.