Back-illuminated integrated imaging device with simplified interconnect routing
US9685475B2 · kind B2 · utility
3Cited by
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36Claims
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Key dates
| Filing date | Sep 8, 2015 |
| Grant date | Jun 20, 2017 |
| Priority date | — |
| Expiry date | Sep 8, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/807
Abstract
A back-illuminated integrated imaging device is formed from a semiconductor substrate including a zone of pixels bounded by capacitive deep trench isolations. A peripheral zone is located outside the zone of pixels. A continuous electrically conductive layer forms, in the zone of pixels, an electrode in a trench for each capacitive deep trench isolation, and forms, in the peripheral zone, a redistribution layer for electrically coupling the electrode to a biasing contact pad. The electrode is located in the trench between a trench dielectric and at least one material for filling the trench.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.