Patent · US Active

Miniature surface mount device with large pin pads

US9685592B2 · kind B2 · utility

3Cited by

14References

32Claims

0Family size

Assignee

Cree Huizhou Solid State Lighting Company Limited · CN

Inventors

Chi Keung Chan · Hong Kong, CN
Chak Hau Pang · Fanling, CN
Fei Hong Li · Huizhou, CN
Yue Kwong Victor Lau · Tseung Kwan O, CN
Jun Zhang · Xi'an, CN
David T. Emerson · Durham, US

Key dates

Filing date	Jun 6, 2011
Grant date	Jun 20, 2017
Priority date	—
Expiry date	Apr 10, 2034

Classification

Technology area (CPC H)Electricity
CPC primaryH10H20/8582
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

One embodiment of the surface mount LED package includes a lead frame and a plastic casing at least partially encasing the lead frame. The lead frame includes a plurality of electrically conductive chip carriers. There is an LED disposed on each one of the plurality of electrically conductive chip carriers. A profile height of the surface mount LED package is less than about 1.0 mm.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.