Method for controlling a piezoelectric device having a piezoelectric element mounted on a substrate
US9685601B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 23, 2014 |
| Grant date | Jun 20, 2017 |
| Priority date | — |
| Expiry date | Apr 23, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N30/85
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A method for controlling a piezoelectric device including a piezoelectric element attached to a substrate, with the substrate and the piezoelectric element being made of materials having different coefficients of thermal expansion includes the step of subjecting the piezoelectric element to a predetermined electric voltage in order to cause a predetermined set deformation of the piezoelectric element. The predetermined electric voltage comprises a compensation portion determined according to ambient temperature to cancel a stress generated on the piezoelectric element due to a differential thermal expansion between the piezoelectric element and the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.