Fabrication methods for bio-compatible devices
US9685689B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 27, 2013 |
| Grant date | Jun 20, 2017 |
| Priority date | — |
| Expiry date | Mar 21, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q1/38
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A method may involve: forming a first bio-compatible layer; forming a conductive pattern on the first bio-compatible layer, wherein the conductive pattern defines an antenna, sensor electrodes, electrical contacts, and one or more electrical interconnects; forming a protective layer over the sensor electrodes, such that the sensor electrodes are covered by the protective layer; mounting an electronic component to the electrical contacts; forming a second bio-compatible layer over the first bio-compatible layer, the electronic component, the antenna, the protective layer, the electrical contacts, and the one or more electrical interconnects; removing a portion of the second bio-compatible layer to form an opening in the second bio-compatible layer; and removing the protective layer through the opening in the second bio-compatible layer to thereby expose the sensor electrodes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.