Patent · US Active

Very high speed, high density electrical interconnection system with impedance control in mating region

US9685736B2 · kind B2 · utility

56Cited by
48References
42Claims
0Family size

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Key dates

Filing dateNov 12, 2015
Grant dateJun 20, 2017
Priority date
Expiry dateNov 12, 2035

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01R13/6585
  • WIPO fieldElectrical machinery, apparatus, energy
  • WIPO sectorElectrical engineering

Abstract

A modular electrical connector with separately shielded signal conductor pairs. In some embodiments, the connector is assembled from modules, each containing a pair of signal conductors with surrounding partially or fully conductive material. In some embodiments, the modules have projecting portions, of conductive and/or dielectric material, that are shaped and positioned to reduce changes in impedance along the signal paths as a function of separation of conductive elements, when the connectors are separated by less than the functional mating range.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.