Device including interposer between semiconductor and substrate
US9686864B2 · kind B2 · utility
4Cited by
8References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 31, 2012 |
| Grant date | Jun 20, 2017 |
| Priority date | — |
| Expiry date | Jul 31, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/10
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A device including a semiconductor, a substrate, and an interposer. The interposer is attached between the semiconductor and the substrate to absorb stresses between the semiconductor and the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.