Printed circuit board and method of manufacturing printed circuit board
US9686869B2 · kind B2 · utility
0Cited by
1References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 29, 2015 |
| Grant date | Jun 20, 2017 |
| Priority date | — |
| Expiry date | Jun 29, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/244
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A write wiring trace is formed over insulating layer. A coating layer, being directly in contact with at least a first portion of a surface of the write wiring trace, is formed over the insulating layer to cover the write wiring trace. A connection terminal is formed over the insulating layer to be electrically connected to the write wiring trace and exposed from the coating layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.